BF flotation cell has two types: type I and type II. Type I is improved as suction cell referring to model SF; type II is improved as direct flow cell referring to model JJF.
Each feeding inlet of Xinhai cyclone unit is installed knife gate valve independently developed by Xinhai. This valve with small dimension reduces the diameter of cyclone unit.
The supports at both ends of cone crusher main shaft, scientific design of crushing chamber, double insurance control of hydraulic and lubricating system.
Wet type overflow ball mill is lined with Xinhai wear-resistant rubber sheet with excellent wear resistance, long service life and convenient maintenance
Wet type grid ball mill is lined with Xinhai wear-resistant rubber sheet with excellent wear resistance design, long service life and convenient maintenance.
Ring groove rivets connection, plate type screen box, advanced structure, strong and durable Vibration exciter with eccentric shaft and eccentric block, high screening efficiency, large capacity
Xinhai improves the traditional specification of crushing chamber by adopting high speed swing jaw and cambered jaw plate.
High-speed hammer impacts materials to crush materials. There are two ways of crushing (Wet and dry)
The cone slide valve is adopted; the failure rate is reduced by 80%; low energy consumption;the separation of different material, improvement of the processing capacity by more than 35%.
Cylindrical energy saving grid ball mill is lined grooved ring plate which increases the contact surface of ball and ore and strengthens the grinding.
20-30%. Rolling bearings replace slipping bearings to reduce friction; easy to start; energy saving 20-30%
Both sides of the impeller with back rake blades ensures double circulating of slurry inside the flotation tank. Forward type tank, small dead end, fast foam movement
Grinding Accuracy, Thickness variation within one wafer between wafers, μm, Within 1.5, ±3.0 Click the equipment photo to open the product catalog PDF.
DISCOs grinding wheels grind silicon wafers, compound semiconductors, crystals, and a wide variety of other materials.
Without any change in processes or addition of equipment, Poligrind helps improve post-grinding surface roughness, die strength, and overall process quality.
This new finish grinding wheel is also able to maintain a gettering effect, It is a chemical-free normal grinding process resulting in a low environmental impact, and allows wafer thinning grinding with ease of operation. Precision Machines
Aug 21, 2013 Disco DFG 850 Wafer Grinder prior to removal from clean room. 2000 Vintage Universal wafer chucks 4"-8" Capable email@example.com
Apr 8, 2009 Here is a basic guide to running a 6" x 18" Used Disco Auto Dicing Machine, Chuck, 8000 RPM #5768 To view Other Grinding Machines visit
arm, the Disco 840 and 841 machines feature a same-cassette return function. In-feed grinding with wafer rotation; Two independently adjustable spindles
The Disco DFG8540 System is a fully automatic in-feed surface grinder. With its processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. Wafer Grinding Equipment List.
Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCOs precision dicing saws and grindingpolishing machines, combined with etchers, surface
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
Coarse and fine silicon grinding 2 different wheels Axis initialization and machine warm-up only at machine starting
Description. The Disco Automatic Grinder DAG 810 Model 810 is a single-spindlesingle-chuck-table unit that performs back-side grinding on samples.
grinder DFG840, Disco Corporation, Tokyo, Japan and G&N surface grinder Nanogrinder,. Grinding Machines Nuernberg, Inc., Erlangen, Germany. 2.2.
Sep 21, 2015 Backgrinding: CORWIL uses automated and semi-automated Disco equipment and grind wheels to process wafers. Speeds, grind wheel grits,
out by using commercial back grinding system Disco Corp. Japan. In thinning process, first the scale using the special equipment called Nanoindenter. This.
From UV irradiation following the back grinding process, to alignment, mounting on dicing frames, and peeling of back grinding tape, all in a single machine. 2. this mounter with the DISCO Corporations DFG8000 series back grinder or
Listings 1 - 24 of 573 Find new and used lapping polishing and grinding semiconductor equipment at LabX. Auctions and classified ads.
Dec 12, 2013 DISCO Solution for Wax Curing thinning process Issue of 6” wafer Wax cured grinding process 12：Throughput . Low Machine UPH.
CNC Machining including turning and milling; Small to large turning capacities with engine lathes to 60″ and VTLs to 68″; Gear shaping and generating
DAStech, a spinoff of Disco, is known as the leader in Slicing Saws and technology. back grind wheels, UV and Non-UV tape for both dicing and back grinding. wafer washers, UV curing equipment and a closed loop system designed to
GTS provides total solution equipment and materials for semiconductor We can economically refurbish your present dicing and back grinding equipment. level of performance we were selected by DISCO HI-TEC AMERICA as its Exclusive
The NBC-ZH series is produced using Discos original technology. READ the operation manual of the cutting grinding equipment before use. • DO NOT USE a
Dec 6, 2017 DISCO has developed a stealth dicing SD*1 laser saw provided the SDBG Stealth Dicing Before Grinding process*2 through DFL7361,
Buehler is a premier manufacturer of metallography equipment for material preparation, testing and analysis. We supply instruments and consumables for
The stringent requirements for these grinding wheels include low damage on .. 7–8, pp. 707–716.  W.P. Sun, Z.J. Pei, G.R. Fisher, 2005, “Fine grinding of silicon wafers: machine .  Disco Website, http:www.disco.co.jp.  Asahi
Aug 15, 2016 Disco Corporation Tokyo, Japan has developed a unique laser wafer a wafer, followed by grinding the wafer to the specified thickness; 3. grinding Strengthening laser processing machine business, Mitsubishi Electric
A wide range of consumables is available for mechanical preparation in order to obtain the smoothest possible surface with minimal deformation.
Technology & Service. 70%. Our Share in World. Semiconductor Cutting and Grinding Equipment. Markets Averages 70%. DISCO values customer feedback.
The Beast Spike Grinding Disc is designed to be use on multiple applications such as removal Equipment: Hand grinder, floor grinder Disco Flat Cup Wheel.
Narrow widths ensure transport ease and a unique side discharge frame keeps cuttings away from the machine while grinding. Our stump grinder line-up
SL3™ System for Seam Phantom Machines & Gen. PolishingGrinding Details 637513. $39.95 EA. In Stock. Cyclone® Super Cluster Grinding Wheels.
The layout of the vertical spindle surface grinding machine using a cup-type wheel is . from Disco , G&N , Koyo , Okamoto , and Strasbaugh .
Results 1 - 25 of 123 refurbished DISCO. If you are looking to buy or sell second hand DISCO, please visit EquipMatching. Grinders & Polishers in Semiconductor Equipment Posted by: DISCO DGP8760+DFM2700 wafer grinder. Active
EXTEC Diamond Grinding Discs are available in standard sizes in both metal or resin bonded varieties with Pressure Sensitive Adhesive PSA, plain back or
The Precision Machines division includes dicing saws, laser saws, grinders, The Precision Processing Tools offers dicing blades, grinding wheels, and dry
Karaoke Machine for Kids Sing Along, Includes 2 Microphones + Disco .. The disco ball makes a grinding noise when its rotating now and weve only had it
Welcome to Disco. DISCO leads the industry in dicing, grinding and polishing technologies. Our dicing equipment is comprised of lasers, singulation
From UV irradiation following the back grinding process, to alignment, mounting on dicing frames, and peeling of back grinding tape, all in a single machine. this mounter with the DISCO Corporations DFG8000 series back grinder or
Oct 24, 2017 Saw Machines. • Cut Precision: 0.1um Dice Before Grind allows for ultrathin . Disco. DDS2010. Tape Expanding + Breaking. Expanding.
Used CMP Chemical Mechanical Planarization equipment for sale by fabsurplus.com. Ecomet-3000, Polishing & Grinding Sample Preparation Equipment, 300 mm 69331 Disco DFP8140, Wafer Polisher - Stress Relief, 200 mm, 01.02.
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